| Overview |
| As a pure MEMS Foundry, MMD offers a broad, flexible range of tools and capabilities, specifically created to more readily tailor processes to individual MEMS customer’s needs. Because we serve only external clients, there are no internal products to get in the way of our highest priority – serving you, the customer. |
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| Device Fabrication |
| MMD’s MEMS foundry includes Class 10, 100, and 1,000 production areas for the highest standards of cleanliness and quality. Below is a summary description of MMD’s tools and capabilities: |
| PECVD (Plasma Enhanced Chemical Vapor Deposition) |
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LPCVD (Low Pressure Chemical Vapor Deposition) |
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Silicon Nitride |
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Polysilicon/Amorphous Silicon |
| Silicon Dioxide |
Silicon Nitride |
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LTO (low temperature oxide) |
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| DC Sputtering |
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E-beam Evaporation |
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Conformal thin films |
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Metal thin films |
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| High Temperature Processing |
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RIE (Reactive Ion Etching) |
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Oxidation |
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Anisotropic dry etching of mainly dielectric thin films |
| Diffusion |
| Annealing |
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| PE (Plasma Etching) |
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Wet Processing |
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Isotropic dry etching of primarily dielectric thin films |
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Isotropic chemical etching Solvent lift-off processin |
| Photo resist removal |
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| Metrology |
| MMD carries a variety of metrology tools and services including SEM, automated visual inspection, line width measurement, optical measurements, probing, electrical tests, and surface profilers. These tools ensure that MMD’s processing operations continually maintain a high level of device quality. |
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| Device Packaging |
| MMD carries a standard set of tools for device packaging include wafer saw, wirebond, and die attach equipment. MEMS packaging needs can vary widely across applications and MMD anticipates serving a broad array of MEMS device needs with its packaging expertise. |
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| For Further Information About MMDs MEMS Foundry Capabilities |
| Please send us an email with a brief summary of your MEMS product or concept, and we will contact you with more information on achieving MEMS design success via Midwest MicroDevices. Double click the link below to send an E-mail. |
| REQUEST INFORMATION VIA EMAIL |
